Ultrafine electrolytic copper powder for EMI shielding with high conductivity silver coating

December 10, 2013

GGP Metalpowder AG, Fürth, Germany, has expanded its traditional product range of electrolytic copper powder to include ultrafine and ultralight dendritic powders. The move is in response to increasing demand in the electronic industry for various applications such as EMI shielding and flexible circuit boards (FCB).

Since copper is the best conductive material for electric current after gold and silver, it is used as low cost alternative to powders out of precious metals whenever possible. However, silver coating is still needed to meet the high demands in technical applications concerning electrical conductivity and it is only a special silver coating technology that provides ultra-low resistance in a disintegrated form (like powder particles) compared to solid material.


As can be seen in the SEM pictures morphology is extremely delicate and requires special treatment and smooth operation in production

Dendritic morphology of electrolytic copper powder gives another advantage over spherical or irregular powders, as it provides multiple contact points within a conductive layer. Also important is that the dendritic shape provides flexibility of the conductive layer in the flexible printed circuit boards increasingly used in smart phones and tablet PC´s.

“The achievements of this new silver coated ultrafine dendritic copper powders opened the door into completely new application and we are extremely happy participating in a new and long term booming market for electrolytic copper powders and silver coated ECP,” stated the company.


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