Plansee introduces new molybdenum materials for CIGS and semiconductor layers

March 12, 2012

Plansee AG’s High Performance Materials division based in Reutte, Austria, has developed two new molybdenum based materials for applications in solar cells and semiconductor wafers. Thanks to its good adhesion to glass and a high electrical conductivity, molybdenum (Mo) is the back contact material in CIGS solar cells. However, when exposed to corrosive atmospheres Mo can be prone to oxidation, and Plansee has found that adding a small amount of tantalum to Mo provides a far superior corrosion resistance compared with the pure Mo metal.

On flexible substrates such as stainless steel foil and polyimide, the new Mo-Ta alloy can function as a corrosion resistant contact and protective layer. It effectively protects the backside of the stainless steel web during the selenization step in the CIGS manufacturing process.

Plansee has also developed a new molybdenum-copper composite material designated Mo-Cu R670 for semiconductor wafer substrates. The company states that the metallic wafer made from the Mo-Cu material ensures optimized heat dissipation in LED chips.

The metallic wafer is bonded to the semiconductor layers at high temperatures. Stresses caused by different coefficients of thermal expansion can lead to cracks in the semiconductor layers. To prevent these defects, the metal wafer ideally possesses the same coefficient of thermal expansion (CTE) as sapphire.

Mo is commonly used for such wafer substrates because it offers good thermal conductivity and is very heat-resistant. However, Mo has a lower coefficient of thermal expansion than sapphire (Al2O3), hence the development of wafer substrates made from the Mo-Cu composite material R670 especially for sapphire-based and high temperature-bonded LED chips. R670 has a thermal conductivity of 170 W/mK and, with 6.7 ppm/K, the same coefficient of thermal expansion as sapphire (Al2O3). 

www.plansee.com  

Edited by: Paul Whittaker, Editor ipmd.net, [email protected]   

News | Articles | Market reviews | Search directory | Subscribe to e-newsletter

 

www.ipmd.net

Powder Metallurgy Review magazine cover

In the latest issue of PM Review…

Download PDF

Extensive Powder Metallurgy industry news coverage, and the following exclusive deep-dive articles and reports:

  • Hot Isostatic Pressing for the production of large, near-net shape components
  • Safeguarding PM part usage in a new automotive industry
  • How to make metal powders., Part 3
  • Company profile: Jiangxi Yuean Advanced Materials

The latest news from the world of metal powders, delivered to your inbox

Don't miss any new issue of PM Review, and get the latest industry news. Sign up to our weekly newsletter.

Sign up

From the industry…

Discover our magazine archive…

The free-to-access PM Review magazine archive offers unparalleled insight into the world of Powder Metallurgy from a commercial and technological perspective through:

  • Reports on visits to leading PM part manufacturers, metal powder manufacturers and industry suppliers
  • Articles on technology and application trends
  • Information on materials developments
  • Reviews of key technical presentations from the international conference circuit
  • International industry news

All past issues are available to download as free PDFs or view in your browser.

 

Browse the archive

 

Looking for PM production equipment, metal powders, R&D support and more?

Discover suppliers of these and more in our
advertisers’ index and buyer’s guide, available in the back of PM Review magazine.

  • Powders & materials
  • Powder process, classification & analysis
  • PM products
  • Atomisers & powder production technology
  • Compaction presses, tooling & ancillaries
  • Sintering equipment & ancillaries
  • Post-processing
  • Consulting & toll sintering
Download PDF
Share via
Copy link