HC Starck introduces MoNb and MoW sputtering targets for touch screen panel applications

March 18, 2015

March 18, 2015

H.C. Starck will introduce its latest range of sputtering targets for Touch Screen Panel (TSP) applications at FPD China 2015, an international tradeshow focusing on the flat panel display industry, taking place March 17-19, Shanghai New International Expo Center.

Curved and flexible touch screens are the latest in HDTV, smart phones, tablets and mobile device technology. Touch screens use H.C. Starck’s molybdenum-niobium (MoNb) targets to sputter thin films for barrier, capping and conducting layers in these devices.

The MoNb alloy enables higher sputtering rates, higher quality film with fewer defects and world-class corrosion resistance. Production of single piece targets, the company states, is one of H.C. Starck’s advantages. Another stated advantage is the higher relative density found in extruded targets compared to Hot Isostatic Press (HIP) targets. The company’s extrusion process produces a diverse portfolio of materials, shapes, sizes and lengths.

H.C. Starck’s molybdenum-tungsten (MoW) planar targets are applied when forming gate and touch sensor layers for TFT- LTPS and in-cell type touch panels. H.C. Starck offers varying compositions for single piece length tiles based on customer requirements. Thin films produced from MoW targets have excellent wet and dry etching characteristics.

H.C. Starck’s newest product line of molybdenum based alloys showcases the company’s ability to customise alloys for electrical performance, corrosion resistance and etch characteristics for higher reliability in TSP applications. These alloys feature large size capabilities with rotary targets up to 4100 mm long, planar targets up to Gen 5 in size as well as segmented (or tiled) targets.

”We are very excited about the latest advancements in touch screen technology,” stated Dmitry Shashkov, Member of H.C. Starck’s Executive Board and Head of the Fabricated Products Division. “The evolving technology in TSP applications such as flexible touch screen devices necessitates higher performance and durability. H.C. Starck’s expertise in sputtering target materials and rapid product development can offer TSP customers the capabilities for improved system performance and cost.”

Development of these innovative alloys is enabled by H.C. Starck’s expertise in thin film characterization and ESBD analysis of textures. Customised alloy development utilises the unique processing of refractory metals, including Powder Metallurgy processing, high temperature rolling, extrusion and rotary forging.


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March 18, 2015

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