Diamond powders encapsulated in metal increase life of diamond compacts
November 19, 2013
Powdermet Inc., Ohio, USA, has announced its DiaBond range of engineered diamond powders designed to improve bonding in metallic matrices, including nickel-, cobalt-, copper-, and aluminium-based binders.
Applications for DiaBond include metal-bond diamond wheels, diamond compacts and cermets, diamond hardfacing products, high conductivity substrates, and other thermal and abrasive products.
The powders are comprised of diamond grains encapsulated in a 1-20 micron coating of cobalt, nickel, chromium, chromium carbide, tungsten, tungsten carbide, copper, aluminium, silicon, or rhenium. These coated diamond powders typically show a three-fold increase in diamond retention, extending life and increasing thermal conductivity and strength of diamond compacts made of Powdermet’s engineered diamond particles.
DiaBond powders are engineered by Powdermet’s patented fluidised bed chemical vapour deposition technology. They can be produced in grit sizes ranging from micron-sized diamond dust to 30 grit diamond abrasives.